Thermal CAD package for multilayer printed circuit boards integrated with two-stack cold plate

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Hung, Y H ^a   Chen, Y Y ^a   Liu, C Y ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; MULTILAYERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN;

X-WINDOWS SYSTEMS;

ELECTRONICS PACKAGING;

EID: 18244430232     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. Chen, Y. Y., 1996, "Thermal CAD Development for Multilayer PCB Structures with a Multi-Stack Cold Plate," Master's Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan.
2. Foley, J. D., van Dam, A., Feiner, S. K. and Hughes, J. F., 1990, Computer Graphics: Principles and Practice, 2nd ed., Addison Wesley Publishing Company, Inc., New York.
3. Hung, Y. H., and Chiou, Y. M., 1996, "Computer-Aided Design for Multi-Layer Cold Plates with Arbitrary Heating Loads," Proceeding of the 1996 International Electronics Packaging Society Conference, Austin, Texas, September 29-October 1, pp.285-296.
4. Hung, Y. H., and Chun, Y. H., 1994, "Thermal Performance Analysis of Cold Plates for Multilayer Structures with Arbitrary Heating Loads," 1994 ASME Winter Annual Meeting, Chicago, Illinois, U. S. A., November 13-17.
5. Hewitt, G. F., 1992, Handbook of Heat Exchanger Design, Chapter 3, Begell House, Inc., New York.
6. Kays, W. M., and London, A. L., 1984, Compact Heat Exchangers, 3rd ed., McGraw-Hill, New York.
7. Kern, D. Q., and Kraus A. D., 1972, Extended Surface Heat Transfer, McGraw-Hill Book Company, New York.
8. Kraus, A. D., and Bar-Cohen, A., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Corporation, Washington.
9. Pieper, R. J., and Kraus, A. D., 1995a, "Cold Plates with Asymmetric Heating Loading: Part I-The Single Stack," EEP-Vol.10-2, In Advances in Electronic Packaging, ASME, New York, pp.865-870.
10. Pieper, R. J., and Kraus, A. D., 1995b, "Cold Plates with Asymmetric Heating Loading: Part II-The Double Stack," EEP-Vol. 10-2, In Advances in Electronic Packaging, ASME, New York, pp.871-876.
11. Wang, L. S., Liu, C. Y., and Hung, Y. H., 1998, " Thermal Computer-Aided Design for Multi-Layer Structures Integrated with Cold Plate," Proceeding of the Eleventh International Symposium on Transport Phenomena (ISTP-11), November 29-December 3, pp.17-22.