Strain relief in Cu-Pd heteroepitaxy

Physical Review Letters

Volumn 94, Issue 14, 2005, Pages

  Lu, Yafeng ^a,b   Przybylski, M ^a   Trushin, O ^c   Wang, W H ^a   Barthel, J ^a   Granato, E ^d   Ying, S C ^e   Ala Nissila, T ^e,f  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b NORTHWEST INSTITUTE FOR NONFERROUS METAL RESEARCH   (China)

^c RUSSIAN ACADEMY OF SCIENCES   (Russian Federation)

^d INSTITUTO NACIONAL DE PESQUISAS ESPACIAIS   (Brazil)

^e BROWN UNIVERSITY   (United States)

^f AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CONTINUUM ELASTICITY THEORY; HETEROEPITAXY; ROOM TEMPERATURE; STRAIN RELAXATION;

COMPRESSIVE STRENGTH; CONTINUUM MECHANICS; ELASTICITY; HETEROJUNCTIONS; MONOLAYERS; PULSED LASER DEPOSITION; REFLECTION HIGH ENERGY ELECTRON DIFFRACTION; RELAXATION PROCESSES; SCANNING TUNNELING MICROSCOPY; THERMAL EFFECTS; ULTRATHIN FILMS;

COPPER ALLOYS;

EID: 18144365528     PISSN: 00319007     EISSN: 10797114     Source Type: Journal    
DOI: 10.1103/PhysRevLett.94.146105     Document Type: Article

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