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Volumn 162-163, Issue SPEC. ISS., 2005, Pages 355-361
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Effect of Al3Sc precipitate on the microstructural evolution during accumulative roll bonding in Al-0.2 wt.% Sc alloy
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Author keywords
Accumulative roll bonding; Al3Sc; High angle grain boundary; Lamellar structure; Zener pinning pressure
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Indexed keywords
AGING OF MATERIALS;
GRAIN BOUNDARIES;
HEAT TREATMENT;
MICROSTRUCTURE;
RECRYSTALLIZATION (METALLURGY);
SCANDIUM ALLOYS;
SHEET METAL;
SOLUTIONS;
STRAIN MEASUREMENT;
ALLOYS;
ALUMINUM;
LAMELLAR STRUCTURES;
PRECIPITATES;
PRECIPITATION (CHEMICAL);
ROLL BONDING;
SUPERCONDUCTING MATERIALS;
ACCUMULATIVE ROLL BONDING (ARB);
AL3SC;
HIGH-ANGLE GRAIN BOUNDARY;
LAMELLAR STRUCTURE;
ZENER PINNING PRESSURE;
ALUMINUM ALLOYS;
CERIUM ALLOYS;
ACCUMULATIVE ROLL BONDING;
AL3SC;
AL3SC PRECIPITATES;
ARTIFICIAL AGING;
EQUIVALENT STRAINS;
HIGH ANGLE GRAIN BOUNDARIES;
SOLUTION TREATMENTS;
ZENER PINNING PRESSURE;
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EID: 17844410675
PISSN: 09240136
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jmatprotec.2005.02.107 Document Type: Conference Paper |
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Times cited : (24)
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References (16)
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