A 3-chamber deposition system for the simultaneous double-sided coating of 5-inch wafers

IEEE Transactions on Applied Superconductivity

Volumn 11, Issue 1 III, 2001, Pages 3856-3858

  Geerk, J ^a   Zaitsev, A ^a   Linker, G ^a   Aidam, R ^a   Schneider, R ^a   Ratzel, F ^a   Fromknecht, R ^a   Scheerer, B ^a   Reiner, H ^b   Gaganidze, E ^c   Schwab, R ^c  

^a Institut für Festkörperphysik   (Germany)

^b Institut für Technische Physik   (Germany)

^c Institut für Materialforschung   (Germany)

Author keywords

Disk resonators; Large area deposition; Superconducting films

Indexed keywords

CHAMBER DEPOSITION SYSTEM; CONTACT LAYER; DISK FILTERS; DISK RESONATORS; DOUBLE SIDED COATING; FILM THICKNESS; SURFACE RESISTANCE;

COMPOSITION; CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); HIGH TEMPERATURE SUPERCONDUCTORS; MICROWAVE DEVICES; SPUTTER DEPOSITION; SURFACE PROPERTIES; THICKNESS MEASUREMENT;

SUPERCONDUCTING FILMS;

EID: 17844408138     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/77.919906     Document Type: Conference Paper

References (5)

1. Simultaneous double-sided deposition of HTS films on 3 inch wafers by ICM-sputtering
2. Calculation of deposition rates in diode sputtering systems
3. 7-x thin films
4. 7 films for high power microwave applications
5. Large-area YBCO films on sapphire for microwave applications