Chemical etching of Cu-ETP copper

Journal of Materials Processing Technology

Volumn 162-163, Issue SPEC. ISS., 2005, Pages 275-279

  Cakir O ^a   Temel, H ^a   Kiyak, M ^b  

^a DICLE UNIVERSITY   (Turkey)

^b YILDIZ TECHNICAL UNIVERSITY   (Turkey)

Author keywords

Chemical etching; Copper; Depth of etch; Surface roughness

Indexed keywords

DISSOLUTION; ETCHING; FABRICATION; IRON ALLOYS; MICROELECTRONICS; MICROSTRUCTURE; MILLING (MACHINING); SOLUTIONS; SURFACE ROUGHNESS; CHLORINATION; CHLORINE COMPOUNDS; COPPER; PRECISION ENGINEERING;

CHEMICAL ETCHING; DEPTH OF ETCH; MICROELECTRONIC COMPONENTS; MICROENGINEERED STRUCTURES;

COPPER; ETCHING;

CHEMICAL ETCHING; CHEMICAL-ETCHING PROCESS; DEPTH OF ETCH; ENGINEERING MATERIALS; EXPERIMENTAL STUDIES; MACHINING CONDITIONS; MICROELECTRONIC COMPONENTS; MICROENGINEERED STRUCTURES;

EID: 17844395728     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2005.02.035     Document Type: Conference Paper

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