Development of a new, more efficient and environmentally friendly method of producing high density interconnects - The "PRIME" process

Circuit World

Volumn 27, Issue 2, 2001, Pages 12-16

  Albin, David ^a   Rames, Jean Claude ^b   Dietel, Claudia ^c   Lenfert, Kai ^c   Rossi, Stephanie ^d   Starkey, David ^a   Down, Joel ^a   Pineda, Ricard ^e   Sardon, Juan Carlos ^e   Goosey, Martin ^e   Graves, John ^e   Bains, Narinder ^e   Cristoph, Frank ^f   Smeets, Frank ^g   Gilen, Willy ^g  

^a Coates Circuit Products ^*  (United Kingdom)

^b MBDA FRANCE   (France)

^c Bayerisches Laserzentrum   (Germany)

^d Cimulec   (France)

^e University of Erlangen ^*

^f UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^g EXEM ESSENCE   (Netherlands)

Author keywords

Environmentally friendly; HDIS circuits; Printed circuit boards

Indexed keywords

DIELECTRIC MATERIALS; ENVIRONMENTAL IMPACT; LASER ABLATION; LASER APPLICATIONS; MICROELECTRONICS; PRINTED CIRCUIT BOARDS; REENGINEERING; SCANNING ELECTRON MICROSCOPY;

ENVIRONMENTAL FRIENDLY METHOD; HIGH DENSITY INTERCONNECTS;

PRINTED CIRCUIT MANUFACTURE;

EID: 17844382948     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/EUM0000000005400     Document Type: Article

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