The effect of ductility minimum temperature in CuNi25 alloy

Journal of Materials Processing Technology

Volumn 162-163, Issue SPEC. ISS., 2005, Pages 379-384

  Nowosielski, R ^a   Sakiewicz, P ^a   Gramatyka, P ^a  

^a SILESIAN UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Cupronickel; Ductility minimum temperature (DMT); Hot ductility; Non uniform deformation

Indexed keywords

COMPOSITION; COMPUTER SIMULATION; CRACK INITIATION; DUCTILITY; FINITE ELEMENT METHOD; IMPURITIES; METAL PRESSING; METALLOGRAPHY; NICKEL ALLOYS; PLASTIC DEFORMATION; STRESS RELAXATION; CERIUM ALLOYS; CRACKS;

CUPRONICKEL; DUCTILITY MINIMUM TEMPERTURE (DMT); MATERIAL STRUCTURE; NON-UNIFORM DEFORMATION;

COPPER ALLOYS; DUCTILITY;

CHEMICAL COMPOSITIONS; CUPRONICKEL; DUCTILITY MINIMUM TEMPERATURES; HIGH-TEMPERATURE DUCTILITY; LITERATURE STUDIES; METALLOGRAPHIC TEST; NON-UNIFORM DEFORMATION; TWO DIMENSIONAL FINITE ELEMENT METHOD;

EID: 17844376257     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2005.02.119     Document Type: Conference Paper

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