Size effect for specific energy in grinding of silicon nitride

Wear

Volumn 225-229, Issue PART II, 1999, Pages 862-867

  Hwang, T W ^a   Evans, C J ^a   Malkin, S ^b,c  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b University of Massachusetts   (United States)

^c ASME   (United States)

Author keywords

Grinding; Silicon nitride; Size effect

Indexed keywords

ABRASIVES; DIAMOND CUTTING TOOLS; GRINDING (MACHINING); GRINDING WHEELS; HARDNESS; MATHEMATICAL MODELS; SILICON NITRIDE;

SPECIFIC GRINDING ENERGY; UPPER BOUND PLOWING MODEL;

WEAR OF MATERIALS;

GRINDING; SILICON NITRIDE;

EID: 17744421090     PISSN: 00431648     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0043-1648(98)00406-2     Document Type: Article

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