A review of thirty-five years of laser trimming with a look to the future

Proceedings of the IEEE

Volumn 90, Issue 10, 2002, Pages 1614-1619

  Deluca, Phil ^a,b  

^a Electro Scientific Industries Inc   (United States)

^b ESI   (United States)

Author keywords

Component trimming; Electronic products; Lasers, materials; Micromachining; Semiconductor devices; Thick film trimming; Workcells

Indexed keywords

ELECTRONIC EQUIPMENT; ELECTRONICS INDUSTRY; MICROMACHINING; PRINTED CIRCUIT BOARDS; SEMICONDUCTOR DEVICES; TRIMMING;

COMPONENT TRIMMING; ELECTRONIC PRODUCTS; LASERS, MATERIALS; THICK-FILM TRIMMING; WORKCELLS;

LASER APPLICATIONS;

EID: 17644373144     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPROC.2002.803668     Document Type: Review

References (4)

1. S. Albin and E. Swenson, "Laser resistance trimming from the measurement point of view," IEEE Trans. Parts, Hybrids, Packag., vol. PHP-8, June 1972.
2. R. C. Headley, M. J. Popwich, and F. J. Anders, "YAG laser trimming of thick film resistors," in Proc. IEEE 23rd Electronic Components Conf., 1973, pp. 47-55.
3. R. Barcey, E. Swenson, and Y. Sun, "Reducing optoelectric response when functionally trimming thin film resistors on Silicon IC's," in Proc. 46th IEEE 1996 ECTC Conf., pp. 242-246.
4. G. A. Bugler, L. D. Heck, B. A. Unger, and L. D. Shepherd, "The STIC technology - A monolithic approach for combining Tantalum and Silicon technologies," IEEE Trans. Comp., Hybrids, Manufact. Technol., Dec. 1981.