Ab initio calculations of ideal tensile strength and mechanical stability in copper

Journal of Physics Condensed Matter

Volumn 16, Issue 7, 2004, Pages 1045-1052

  Cerny M ^a   Sob M ^b   Pokluda, J ^a   Sandera P ^a  

^a BRNO UNIVERSITY OF TECHNOLOGY   (Czech Republic)

^b INSTITUTE OF PHYSICS OF MATERIALS   (Czech Republic)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICAL STABILITY; VIENNA AB INITIO SIMULATION PACKAGE (VASP);

COMPACTION; COMPUTER SIMULATION; CRYSTALS; ELASTICITY; LATTICE CONSTANTS; LOADING; STRAIN; STRESS ANALYSIS; TENSILE STRENGTH; TENSILE TESTING; THIN FILMS;

COPPER;

EID: 17044459033     PISSN: 09538984     EISSN: None     Source Type: Journal    
DOI: 10.1088/0953-8984/16/7/004     Document Type: Article

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