Progress on 850 nm flip chip bondable VCSEL for optical interconnects

Materials Research Society Symposium - Proceedings

Volumn 486, Issue , 1998, Pages 79-84

  Cunningham, J E ^a   Jan, W Y ^a   Goossen, K W ^a   Krishnamoorthy, A ^a   Walker, J A ^a   Tseng, B ^a   Giaritta, G ^a   Lothian, J ^a   Kropf, R ^a   Brenner, I ^a   Sciortino, P ^a   Chu, G ^a   Leibenguth, R ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; FLIP CHIP DEVICES; NANOSTRUCTURED MATERIALS; SEMICONDUCTOR QUANTUM WELLS; SILICON WAFERS; VLSI CIRCUITS;

VCSEL DEVICES;

OPTICAL INTERCONNECTS;

EID: 17044458648     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)