Dependence of diffusion barrier properties in microstructure of reactively sputtered TiN films in Al alloy/TiN/Ti/Si system

Applied Surface Science

Volumn 117-118, Issue , 1997, Pages 308-311

  Sobue, S ^a   Yamauchi, T ^a   Suzuki, H ^a   Mukainakano, S ^a   Takenaka, O ^a   Hattori, T ^a  

^a DENSO CORPORATION   (Japan)

Author keywords

Barrier metal; Contact metallization; Reactive sputtering; Solid phase reaction; TiN

Indexed keywords

ALUMINUM ALLOYS; CRYSTAL MICROSTRUCTURE; DIFFUSION IN SOLIDS; HEAT TREATMENT; METALLIC FILMS; SEMICONDUCTING FILMS; SPUTTERING; TERNARY SYSTEMS; TRANSMISSION ELECTRON MICROSCOPY;

CONTACT METALLIZATION; DIFFUSION BARRIER PROPERTIES;

TITANIUM NITRIDE;

EID: 17044454985     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(97)80099-2     Document Type: Article

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