Cutting for QFN packaging by diode pumping solid state laser system

2004 Semiconductor Manufacturing Technology Workshop Proceedings, SMTW

Volumn , Issue , 2004, Pages 123-126

  Li, Chun Hao ^a   Tsai, Ming Jong ^a   Chen, Richard ^a   Lee, Chen Hau ^a   Hong, Sheng Wen ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE; LASER APPLICATIONS; PRINTED CIRCUIT BOARDS; PUMPING (LASER); SEMICONDUCTOR LASERS; SOLID STATE LASERS;

IC PACKAGING; MASS PRODUCTION; QUAD FLAT NO-LEAD (QFN) PACKAGING; SEMICONDUCTOR INDUSTRY;

ELECTRONICS PACKAGING;

EID: 17044422917     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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7. Hypertherm Fast Laser, website: "www.hypertherm.com"
8. H.C.Man, J.Duan, T.M.Yue, "Design and Characteristic Analysis of Supersonic Nozzles for High Gas Pressure Laser Cutting", Journal of Materials Processing Technology 63, pp 217-222, 1997