Scanning acoustic force microscopy characterization of thermal expansion effects on the electromechanical properties of film bulk acoustic resonators

Applied Physics Letters

Volumn 86, Issue 8, 2005, Pages 1-3

  San Paulo, A ^a   Liu, X ^a,b   Bokor, J ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Cornell University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILM BULK ACOUSTIC RESONATORS; SCANNING ACOUSTIC FORCE MICROSCOPY; SIGNAL AMPLITUDES; THERMAL RELAXATION TIME;

ACOUSTIC WAVES; AMPLITUDE MODULATION; DENSITY (SPECIFIC GRAVITY); HEAT CONDUCTION; HEAT TRANSFER; MICROELECTROMECHANICAL DEVICES; NATURAL FREQUENCIES; SIGNAL PROCESSING; SPECIFIC HEAT; THERMAL EXPANSION; VIBRATIONS (MECHANICAL);

ACOUSTIC RESONATORS;

EID: 17044419241     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1866508     Document Type: Article

References (13)

1. R. Ruby and P. Merchant, Proceedings of the 1994 IEEE Frequency Control Symposium (IEEE, Piscataway, NJ, 1994), p. 135.
2. K. M. Lakin, J. R. Belsick, J. P. McDonald, K. T. McCarron, and C. W. Andrus, Tech. Dig. IEEE MTT-S, 2002, p. 1487.
3. R. Ruby, P. Bradley, J. D. Larson III, and Y. Oshmyansky, Electron. Lett. 35, 794 (1999).
4. J. D. Larson III, R. Ruby, P. Bradley, J. Wen, S. L. Kok, and A. Chien, Proceedings of the 2000 IEEE Ultrasonics Symposium (IEEE, Piscataway, NJ, 2000), p. 869.
5. G. G. Fattinger and P. T. Tikka, Appl. Phys. Lett. 79, 290 (2001).
6. J. E. Graebner, H. F. Safar, B. Barber, P. L. Gammel, J. Herbsommer, L. A. Fetter, J. Pastalan, H. A. Huggins, and R. E. Miller, Proceedings of the 2000 IEEE Ultrasonics Symposium (IEEE, Piscataway, NJ, 2000), p. 635.
7. K. L. Telschow, V. A. Deason, D. L. Cottle, and J. D. Larson III, Proceedings of the 2000 IEEE Ultrasonics Symposium (IEEE, Piscataway, NJ, 2000), p. 631.
8. T. Hesjedal, E. Chilla, and H.-J. Fröhlich, Appl. Phys. Lett. 70, 1372 (1997).
9. H. Safar, R. N. Kleiman, B. P. Barber, P. L. Gammel, J. Pastalan, H. Huggins, L. Fetter, and R. Miller, Appl. Phys. Lett. 77, 136 (2000).
10. A. San Paulo, X. Liu, and J. Bokor, Tech. Dig. IEEE MEMS, 2004, p. 169.
11. R. Hickey, D. Sameoto, T. Hubbard, and M. Kujath, J. Micromech. Microeng. 13, 40 (2003).
12. S. Sherrit, X. Bao, D. A. Sigel, M. J. Gradziel, S. A. Askins, B. P. Dolgin, and Y. Bar-Cohen, Proceedings of the 2001 IEEE Ultrasonics Symposium (IEEE, Piscataway, NJ, 2001), p. 1097.
13. R. Ruby (private communication).