Conductive adhesives containing Ag-Sn alloys as conductive filler

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

Volumn , Issue , 2004, Pages 57-62

  Suzuki, Kenichi ^a   Shirai, Yukio ^a   Mizumura, Noritsuka ^a   Komagata, Michinori ^a  

^a NAMICS CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; BINARY ALLOYS; CONDUCTIVE MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; ELECTRONIC EQUIPMENT; STRENGTH OF MATERIALS; SURFACE MOUNT TECHNOLOGY;

CONDUCTIVE FILLERS; CONTACT RESISTANCE; IONIC-MIGRATION; ISOTROPIC CONDUCTIVE ADHESIVES (ICA);

ADHESIVES;

EID: 17044389777     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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