System in Package "the rebirth of SIP"

Proceedings of the Custom Integrated Circuits Conference

Volumn , Issue , 2004, Pages 681-686

  Brown, Kenneth M ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; GLASS CERAMICS; MULTILAYERS; OPTIMIZATION; PERSONAL DIGITAL ASSISTANTS; SEMICONDUCTOR MATERIALS; STATIC RANDOM ACCESS STORAGE; THIN FILMS;

MEMORY SYSTEMS; MULTICHIP MODULE (MCM); MULTICHIP PROCESSORS; SYSTEM ON CHIP (SOC);

MICROPROCESSOR CHIPS;

EID: 17044369198     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. I Turlik, "Interconnect Substrate Technologies", in Physical Architecture of VLSI Systems, John Wiley & Sons, 1994, p. 137.
2. A Reinhardt, H Tashiro, B Elgin, "The Camphone Revolution", Business Week-Online, European Business, April 12, 2004.
3. Internal Document - Intel internal cost analysis.
4. Intel volumes alone are >150 million units in 2004.