40Gbit/s "fish ladder" signal path and connectorized signal path in ceramic and organic packages for OC768 applications

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 239-242

  Pillai, Edward R ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BICMOS TECHNOLOGY; CERAMIC MATERIALS; CHIP SCALE PACKAGES; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; FISH; FISHWAYS; LADDERS; PRINTED CIRCUIT DESIGN; PRINTED CIRCUITS; PRODUCT DESIGN; SCATTERING PARAMETERS; SURFACE MOUNT TECHNOLOGY;

ADAPTIVE RECEIVERS; ELECTRICAL MODELING; HIGH-SPEED NETWORKING; HIGH-SPEED SIGNALS; PACKAGING SOLUTIONS; PRINTED CIRCUIT BOARDS (PCB); S-PARAMETER MEASUREMENTS; TRANSMISSION LINE STRUCTURES;

PRINTED CIRCUIT BOARDS;

EID: 1642576431     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057923     Document Type: Conference Paper

References (1)

1. E. Pillai, " Unlimited High-speed Differential Pairs in Multilayer Ceramic (MLC) Packaging for ASIC, OC192, and OC768 Applications," IBM Micronews, Vol. 7, No. 4, 2001: 18.