Study of Loading Effect on Dry Etching Process

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5130, Issue , 2003, Pages 228-233

  Chang, Shih Ming ^a   Chin, Chih Cheng ^a   Wang, Wen Chuan ^a   Lu, Chi Lun ^a   Chin, Sheng Chi ^a   Hsieh, Hong Chang ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Dry etching process; Loading effect

Indexed keywords

DEGRADATION; ERROR ANALYSIS; MASKS; PHOTOLITHOGRAPHY; TECHNOLOGY;

LOADING EFFECTS; PATTERN DENSITY;

DRY ETCHING;

EID: 1642555738     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.504193     Document Type: Conference Paper

References (1)

1. S. Sato, M. Koyama, M. Katsumata, I. Kagami and H. Kawahira, "Advanced Pattern Correction Method for Fabricating Highly Accurate Reticles", SPE, Vol. 4754(2002) p. 195-203.