High-Resolution Etching of MoSi using Electron Beam patterned chemically amplified resist

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5130, Issue , 2003, Pages 234-245

  Mueller, Mark ^a   Komarov, Serguei ^a   Baik, Ki Ho ^a  

^a Etec Systems   (United States)

Author keywords

Chemically amplified resist; Mebes eXara; Mebes Quadra; MoSi; Phase shift mask; Photo mask dry etch; Tetra

Indexed keywords

CHEMICALLY AMPLIFIED RESIST; MEAN-TO-TARGET (MTT); PHASE ANGLES; PHOTOMASKS;

ELECTRON BEAMS; ETCHING; EXTRAPOLATION; LITHOGRAPHY; MASKS; QUARTZ; SCANNING ELECTRON MICROSCOPY; SULFUR COMPOUNDS;

MOLYBDENUM COMPOUNDS;

EID: 1642555736     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.504195     Document Type: Conference Paper

References (8)

1. Mueller M., Komarov S., and Baik KH, "Dry Etching of Chrome for Photomasks for 100nm Technology using Chemically Amplified Resist", Photomask Japan, 2002, SPIE Vol. 4754, 350-360, (2002).
2. Buie M.J., Stoehr B., Buxbaum A., and Ruhl G., "En Endpoint Solution for Photomask Chrome Loads Down to 0.25%", SPIE vol.4562-616 (2002).
3. Applied Materials sales brochures for the TETRA photomask etch system.
4. Baik KH, Lem H., Dean R., Osborne S., Mueller M., and Abboud F., "Comparative study between REAP 200 and FEP171 CAR with 50kV Raster E-beam System for Sub-100nm Technology", to be published, PMJ, (2003).
5. Abboud F., Baik KH, Chakarian V., Cole D., Dean R., Gesley M., Gillman H., Moore W., Mueller M., Naber B., Newman T., Romin P., Raymond F., and Rougieri M., "Raster Scan Patterning Solution for 100nm and 70nm OPC Masks", BACUS News vol. 18, issue 9 (2002).
6. Cottle R., "Tip Shape Effects in Scanning Probe Microscopy", SPIE vol. 4562-274 (2002).
7. Plumhoff J., Constantine C., Strawn C., Shin J., "Investigation of MoSi Etch Processes for Embedded Attenuating Phase Shift Mask Applications Utilizing a Next Generation ICP Source", SPIE vol. 4562-694 (2002).
8. 2/He Plasmas", SPIE vol. 4562-561.