Flow and heat transfer analysis during tape layup process of APC-2 prepregs

Journal of Thermoplastic Composite Materials

Volumn 17, Issue 1, 2004, Pages 5-12

  Kim, H J ^a   Kim, Sun K ^b   Lee, W I ^b  

^a UNIVERSITY OF DELAWARE   (United States)

^b Seoul National University   (South Korea)

Author keywords

Conjugate heat transfer; Flow analysis; Tape layup; Thermoplastic

Indexed keywords

COMPOSITE MATERIALS; FINITE ELEMENT METHOD; HEAT CONDUCTION; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; ITERATIVE METHODS; NUMERICAL ANALYSIS; SURFACES; TEMPERATURE;

CONJUGATE HEAT TRANSFER; FLOW ANALYSIS; HEAT TRANSFER ANALYSIS; TAPE LAYUP PROCESS;

THERMOPLASTICS;

EID: 1642537575     PISSN: 08927057     EISSN: None     Source Type: Journal    
DOI: 10.1177/0892705704033339     Document Type: Article

References (9)

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4. Grove, S.M. (1998). Thermal Modelling of Tape Laying with Continuous Carbon Fibre-Reinforced Thermoplastic, Journal of Composite Materials, 19: 367-375.
5. Kim, S.K., Koo, B.Y. and Lee, W.I. (2000). The Evaluation of the Heat Transfer Coefficient During Hot-jet Impingement Using an Inverse Method with Regularization Parameter Optimization, International Journal of Transport Phenomena, 2(3): 173-186.
6. Computational Dynamics Limited (1999). Star-CD User Guide V3.10A. Computational Dynamics, Limited, London, UK.
7. Kim, H.J. (1999). Analyses of Tape Lay-up Process of Thermoplastic Composite, Ph. D Thesis, Seoul National University, Seoul, Korea.
8. Özişik, M. N. (1993). Heat Conduction, 2nd Edn., John Wiley and Sons, New York.
9. Carey, G.F. and Oden, J.T. (1984). Finite Elements: Computational Aspect, Prentice Hall, Englewood Cliffs, NJ.