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Volumn 12, Issue 2, 2004, Pages 311-323
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Evolution of liquid-bond strength in powder injection moulding compact during thermal debinding: Numerical simulation
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Author keywords
[No Author keywords available]
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Indexed keywords
POWDER INJECTION MOLDING (PIM);
THERMAL DEBINDING;
BOND STRENGTH (MATERIALS);
CAPILLARY FLOW;
COMPACTION;
COMPUTER SIMULATION;
DEFECTS;
FUNCTIONAL POLYMERS;
HEAT CONVECTION;
MATHEMATICAL MODELS;
MULTIPHASE FLOW;
PLASTICIZERS;
POWDERS;
PYROLYSIS;
SINTERING;
THERMAL DIFFUSION;
THERMAL EFFECTS;
VAPORS;
INJECTION MOLDING;
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EID: 1642392582
PISSN: 09650393
EISSN: None
Source Type: Journal
DOI: 10.1088/0965-0393/12/2/011 Document Type: Article |
Times cited : (4)
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References (34)
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