Hygrothermal Modeling of Thick Thermoset Resin during Electron-beam-cure - Part I: Methodology and Modeling Cure Kinetics

Journal of Composite Materials

Volumn 38, Issue 5, 2004, Pages 357-374

  Moon, Sung Won ^a   Morgan, Roger J ^a   Lau, Sai C ^a  

^a Texas AandM University   (United States)

Author keywords

Cure kinetics; E beam cure; Epoxy resin; Glass transition temperature; Moisture absorption; Polymer composite; Process simulation; Radiation processing; Thermoset; Yield strength

Indexed keywords

ABSORPTION; COMPOSITE MATERIALS; COMPUTER SIMULATION; CURING; ELECTRON BEAMS; ELECTRON IRRADIATION; EPOXY RESINS; GLASS TRANSITION; HEAT TRANSFER; ION ACOUSTIC WAVES; MOISTURE; POLYMERIZATION; REACTION KINETICS; YIELD STRESS;

CURE KINETICS; ELECTRON BEAM CURING; MOISTURE ABSORPTION; POLYMER COMPOSITES; RADIATION PROCESSING;

THERMOSETS;

EID: 1642323583     PISSN: 00219983     EISSN: None     Source Type: Journal    
DOI: 10.1177/0021998304040256     Document Type: Article

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