Ni overlayers on biaxially textured Ni-alloy and Cu substrates by DC sputtering

Superconductor Science and Technology

Volumn 17, Issue 3, 2004, Pages 527-531

  Rutter, N A ^a   Goyal, A ^a   Vallet, C E ^a   List, F A ^a   Lee, D F ^a   Heatherly, L ^a   Kroeger, D M ^a  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION RATE; FILM THICKNESS; OVERLAYERS; SEED LAYER;

ATOMIC FORCE MICROSCOPY; COPPER; FILMS; NICKEL ALLOYS; SPUTTER DEPOSITION; SUBSTRATES; TEXTURES; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS;

NICKEL;

EID: 1642293423     PISSN: 09532048     EISSN: None     Source Type: Journal    
DOI: 10.1088/0953-2048/17/3/037     Document Type: Article

References (9)

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9. Goya A 2004 in preparation