Thermal properties of thin and thick Ni 3 Al cluster assembled layers: An atomic scale simulation study

Applied Surface Science

Volumn 226, Issue 1-3 SPEC. ISS., 2004, Pages 161-166

  Hou, M ^a   Moskovkin, P ^a,b  

^a UNIVERSITÉ LIBRE DE BRUXELLES   (Belgium)

^b KURCHATOV INSTITUTE   (Russian Federation)

Author keywords

Coalescence; Diffusion; Interfaces; Modelling; Nanostructured materials

Indexed keywords

ACTIVATION ENERGY; BOUNDARY CONDITIONS; CARRIER CONCENTRATION; COALESCENCE; COMPUTER SIMULATION; CONDENSATION; DIFFUSION; ESTIMATION; MOLECULAR DYNAMICS; NICKEL ALLOYS; PLASTIC DEFORMATION; THICK FILMS;

INTERFACES; SIZE DISTRIBUTIONS; SUBSTRATE SURFACES;

NANOSTRUCTURED MATERIALS;

EID: 1642272874     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2003.11.016     Document Type: Conference Paper

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