Two-dimensional thermoelastic analysis of a functionally graded cylindrical panel due to nonuniform heat supply

Mechanics Research Communications

Volumn 32, Issue 4, 2005, Pages 429-443

  Ootao, Yoshihiro ^a   Tanigawa, Yoshinobu ^a  

^a Osaka Prefecture University   (Japan)

Author keywords

Cylindrical panel; Exact solution; Functionally graded material; Plane strain problem; Thermoelasticity

Indexed keywords

ELASTIC MODULI; ELASTICITY; FUNCTIONS; THERMAL CONDUCTIVITY; THERMAL STRESS; THERMOELASTICITY;

CYLINDRICAL PANELS; EXACT SOLUTION; HEAT SUPPLY; PLANE STRAIN PROBLEMS;

FUNCTIONALLY GRADED MATERIALS;

EID: 16344391610     PISSN: 00936413     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechrescom.2004.10.018     Document Type: Article

References (10)

1. M. Jabbari, S. Sohrabpour, and M.R. Eslami Int. J. Pres. Ves. Piping 79 2002 493
2. M. Jabbari, S. Sohrabpour, and M.R. Eslami Trans. ASME, J. Appl. Mech. 70 2003 111
3. S.P. Jeon, Y. Tanigawa, and D. Sone J. Thermal Stresses 20 1997 325
4. M.P. Lutz, and R.W. Zimmerman J. Thermal Stresses 19 1996 39
5. N. Noda, and T. Tsuji Trans. Jpn. Soc. Mech. Eng. 57A 1991 98 (in Japanese)
6. B.V. Sankar, and J.T. Tzeng AIAA 40 2002 1228
7. Y. Tanigawa, H. Morishita, and S. Ogaki Trans. Jpn. Soc. Mech. Eng. 65A 1999 1018 (in Japanese)
8. S.S. Vel, and R.C. Batra AIAA 40 2002 1421
9. G.R. Ye, W.Q. Chen, and J.B. Cai Mech. Res. Commun. 28 2001 535
10. R.W. Zimmerman, and M.P. Lutz J. Thermal Stresses 22 1999 177