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Volumn 195, Issue 2-3, 2005, Pages 130-137
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Electrolytical modification of Fe hollow spheres by Cu, Ni and Ni-Cu binary coatings
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Author keywords
Cellular solid; Complexes; Fluidized bed; Hollow particles; Ni Cu; Plating
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Indexed keywords
COPPER;
CURRENT DENSITY;
ELECTRODEPOSITION;
ELECTROLYSIS;
IRON;
MORPHOLOGY;
NICKEL;
PARTICLE SIZE ANALYSIS;
CELLULAR SOLIDS;
COATING LAYERS;
COPPER COATINGS;
HOLLOW PARTICLE SIZE;
COATING TECHNIQUES;
COATING;
ELECTROLYSIS;
FLUIDIZED BED;
PLATING;
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EID: 16244398052
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2004.07.073 Document Type: Article |
Times cited : (12)
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References (19)
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