Corrosion behaviors of nanocrystalline and conventional polycrystalline copper

Journal of Materials Science

Volumn 40, Issue 4, 2005, Pages 1019-1022

  Yu, J K ^a   Han, E H ^a   Lu, L ^a   Wei, X J ^a   Leung, M ^b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC POLARIZATION; COLLOIDS; CORROSION RESISTANCE; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; CURRENT DENSITY; ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL ELECTRODES; ELECTRODEPOSITION; NANOSTRUCTURED MATERIALS; PASSIVATION; POLYCRYSTALLINE MATERIALS; POROSITY;

NANOCRYSTALLIZATION; PASSIVE FILMS; REFERENCE ELECTRODE (RE); SATURATED CALOMEL ELECTRODE (SCE); WORKING ELECTRODE (WE);

COPPER;

EID: 16244392457     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-6524-1     Document Type: Article

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