Characterization of Co-planar silicon transmission lines with and without slow-wave effect

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2004, Pages 21-24

  Kim, Woopoung ^a   Swaminathan, Madhavan ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMPEDANCE; ELECTRIC CONDUCTIVITY; FREQUENCIES; MATHEMATICAL MODELS; SILICON; SUBSTRATES; WAVE EFFECTS; WAVE PROPAGATION;

CO-PLANAR LINES; PROPAGATION CONSTANT; PROPAGATION EFFECT; WAVE MODE;

ELECTRIC LINES;

EID: 15944414595     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. W.R. Eisenstadt and Y. Eo, "S-Parameter-Based IC Interconnect Transmission Line Characterization," IEEE Trans. Components, Hybrids, and Manufacturing Tech., Vol. 15, pp. 483-490, Aug. 1992.
2. D.F. Williams, U. Arz and H. Grabinski, "Accurate characteristic impedance measurement on silicon," IEEE MTT-S International Microwave Symposium Digest, pp. 1917-1920, Jun. 1998.
3. G. Carchon and B. Nauwelaers, "Accurate transmission line characterization on high and low-resistivity substrates," IEE Proceedings-Microwaves, Antennas and Propag., vol. 148, pp. 285-290, Oct. 2001.
4. th IEEE Workshop on Signal Propagation on Interconnects, pp. 85-88, Heidelberg, 2004.
5. H. Hasegawa, M. Furukawa and H. Yanai, "Properties of Microstrip Line on Si-SiO2 System," IEEE Trans. Microwave Theory and Tech., vol. 19, pp. 869-881, Nov. 1971.
6. Woopoung Kim, Development of Measurement-based Time-domain Models and its Application to Wafer Level Packaging, Ph.D dissertation, Georgia Institute of Technology, June 2004.
7. Avant!, Star-Hspice Manual, Release 2001. 2, pp. 18-27, 2001.