Future semiconductor detectors using advanced microelectronics with post-processing, hybridization and packaging technology

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 541, Issue 1-2, 2005, Pages 274-285

  Heijne, Erik H M ^a  

^a CERN   (Switzerland)

Author keywords

3D technology; LHC; Silicon pixel detector; Tracking vertex detector; Vector detector

Indexed keywords

CMOS INTEGRATED CIRCUITS; COLLIDING BEAM ACCELERATORS; ELECTRONICS PACKAGING; MICROELECTRONICS; RADIATION HARDENING; SILICON SENSORS; SILICON WAFERS; VECTORS;

3D TECHNOLOGY; LHC; SILICON PIXEL DETECTORS; TRACKING VERTEX DETECTORS; VECTOR DETECTORS;

SEMICONDUCTOR DEVICES;

EID: 15844394801     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2005.01.067     Document Type: Conference Paper

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