Advanced thin dicing blade for sapphire substrate

Science and Technology of Advanced Materials

Volumn 6, Issue 2, 2005, Pages 120-122

  Matsumaru, Koji ^a   Takata, Atsushi ^b   Ishizaki, Kozo ^a  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

^b Nano TEM Co Ltd   (Japan)

Author keywords

Cutting ability; Diamond; Dicing blades; Porous material; Sapphire

Indexed keywords

DIAMONDS; FRACTURE; NICKEL ALLOYS; POROUS MATERIALS; SAPPHIRE; WEAR OF MATERIALS;

CUTTING ABILITY; CUTTING DEPTH; CUTTING FORCE; DICING BLADES;

CUTTING TOOLS;

EID: 15844378798     PISSN: 14686996     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.stam.2004.11.002     Document Type: Article

References (5)

1. J. Nishizawa Light Emitting Diode and its Applications 2003 SangyoTosho Tokyo pp. 66-68
2. K. Matsumaru, and A. Takata Fabrication of porous metal bonded diamond grinding wheels for flat-surface nanomachining MRS Bulletin 26 7 2001 544 546
3. K. Matsumaru, A. Takata, and K. Ishizaki Porous cast-iron bonded diamond grinding wheel Journal of Ceramics Processing Research 3 2 2002 80 81
4. 3 by constant-force-feeding grinding systems Advances in Technology of Materials and Materials Processing Journal 5 2 2003 50 53
5. H.J. Kim, K. Matsumaru, A. Takata, and K. Ishizaki Reduction of ceramics machining defects by regulated force feeding grinding system Advances in Technology of Materials and Materials Processing Journal 6 2 2004 290 297