Chemical and diffusion-controlled curing kinetics of an underfill material

Microelectronics Reliability

Volumn 45, Issue 3-4, 2005, Pages 689-695

  He, Yi ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CHEMICAL REACTIONS; CURING; DIELECTRIC MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; ISOTHERMS; MICROPROCESSOR CHIPS; REGRESSION ANALYSIS;

BALL GRID ARRAYS (BGA); CHIP SCALE PACKAGES (CSP); CURING KINETICS; DIELECTRIC ANALYSIS;

ELECTRONICS PACKAGING;

EID: 15744376724     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.08.013     Document Type: Article

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