Behavior of electroless Cu deposition in CuSO4-HF solution

Journal of the Electrochemical Society

Volumn 152, Issue 3, 2005, Pages

  Zhong, Sheng ^a   Yang, Zhi Gang ^a   Cai, Jian ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANODES; COPPER COMPOUNDS; COPPER PLATING; CORROSION; DIFFUSION; HYDROGEN INORGANIC COMPOUNDS; MICROELECTROMECHANICAL DEVICES; POLYCRYSTALLINE MATERIALS; REACTION KINETICS; REDUCTION; SILICON WAFERS; SOLUTIONS; ULSI CIRCUITS;

ARRHENIUS LAW; BOLTZMANN CONSTANT; CU DEPOSITION; MICROELECTROMECHANICAL SYSTEMS (MEMS);

ELECTROLESS PLATING;

EID: 15744361991     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1859692     Document Type: Article

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