Optimization of hot-press conditions of Zn4Sb3 for high thermoelectric performance: III. Effect of starting particle size on thermoelectric and mechanical properties

Journal of Alloys and Compounds

Volumn 392, Issue 1-2, 2005, Pages 295-299

  Ueno, K ^a   Yamamoto, A ^a   Noguchi, T ^a   Inoue, T ^a   Sodeoka, S ^a   Obara, H ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Electronic transport; Intermetallic; Powder metallurgy; Semiconductor

Indexed keywords

ANTIMONY; BENDING STRENGTH; ELECTRIC RESISTANCE; ELECTRON TRANSPORT PROPERTIES; FRACTURE TOUGHNESS; GRAIN BOUNDARIES; HOT PRESSING; INTERMETALLICS; OPTIMIZATION; PARTICLE SIZE ANALYSIS; POWDER METALLURGY; POWDERS; SEEBECK EFFECT; THERMOELECTRICITY; VACUUM APPLICATIONS; X RAY DIFFRACTION;

ELECTRONIC TRANSPORT; SEEBECK COEFFICIENT; SINGLE EDGED NOTCHED BEAM (SENB); TOSHIMA MANUFACTURING COMPANY (CO);

ZINC ALLOYS;

EID: 15544373026     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2004.08.078     Document Type: Article

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