Prediction of thermal contact conductance by surface deformation analysis

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 369, Issue 7, 2001, Pages 43-50

  Singhal, Vishal ^a   Garimella, Suresh V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Contact conductance; Contact resistance; Electronics cooling; Metallic contacts; Surface deformation analysis

Indexed keywords

CERAMIC MATERIALS; COOLING; ESTIMATION; HARDNESS; MATHEMATICAL MODELS; METALS; POISSON RATIO; POLYMERS; SURFACE PROPERTIES; SURFACE ROUGHNESS; YIELD STRESS;

CONTACT CONDUCTANCE; CONTACT RESISTANCE; ELECTRONICS COOLING; METALLIC CONTACTS; SURFACE DEFORMATION ANALYSIS;

THERMAL CONDUCTIVITY;

EID: 1542713683     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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