New technique to produce buried channel waveguides in glass

Optical Engineering

Volumn 37, Issue 4, 1998, Pages 1111-1114

  Pélissier, Serge ^a,c,d,e   Pigeon, Florent ^a,e,f,g   Biasse, Béatrice ^b,d,h   Zussy, Marc ^b   Pandraud, Gregory ^a   Mure Ravaud, Alain ^a  

^a UNIVERSITÉ JEAN MONNET   (France)

^b CEA LETI   (France)

^c UNIVERSITÉ PARIS SACLAY   (France)

^d GRENOBLE INSTITUTE OF TECHNOLOGY   (France)

^e UNIVERSITÉ JEAN MONNET   (France)

^f Microelectronics Department   (France)

^g TSI Laboratory

^h UNIV GRENOBLE ALPES   (France)

Author keywords

Optical waveguides; Wafer direct bonding

Indexed keywords

EID: 1542681638     PISSN: 00913286     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.601647     Document Type: Article

References (8)

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4. F. Pigeon, B. Biasse, and M. Zussy, "Low-temperature Pyrex glass wafer direct bonding," Electron. Lett. 31, 792-793 (1995).
5. + ion exchange in BK7 and Pyrex glass," IEEE J. Quantum Electron. QE-22, 892-895 (1986).
6. S. I. Najafi, Introduction to Glass Integrated Optics, Artech House, Boston (1992).
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8. F. Pigeon and B. Biasse, French Patent No. 9408343, July 6, 1994. European Patent No. 95401596.2-2205.