A novel cooling enhancement in microelectronic devices and systems using oscillatory impinging air jets

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 369, Issue 7, 2001, Pages 81-89

  Chiriac, Victor Adrian ^a   Lee, Tien Yu Tom ^a   Rosales, Jorge Luis ^b  

^a MOTOROLA INC   (United States)

^b Phoenix Anal/Design Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

OSCILLATORY IMPINGING AIR JETS;

COOLING; HEAT SINKS; HEAT TRANSFER; HIGH TEMPERATURE EFFECTS; JETS; NOZZLES; OSCILLATIONS; THERMAL CONDUCTIVITY; THERMAL DIFFUSION;

MICROELECTRONICS;

EID: 1542642571     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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