Polarization Effects in Polyimides

Journal of the Electrochemical Society

Volumn 131, Issue 11, 1984, Pages 2717-2720

  Lytle, S ^b  

^a Solavolt International ^*  (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 1542581060     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/1.2115390     Document Type: Article

References (9)

1. K. Mukai, A. Saiki, S. Harada, and S. Shoji, International Electron Devices Meeting, p. 16 (1977).
2. A. Saiki, K. Mukai, S. Takahashi, K. Tamanaka, and S. Harada, “Reliability of Semiconductor Devices Using a Resin Insulation Structure, ” Hitachi Central Research Laboratories Bulletin, Japan.
3. R. Larsen, IBM J. Res. Dev., 24, 268 (1980).
4. A. Gregoritsch, Polyimide Passivation Reliability Study, Rel. Physics, 14th Annual Proceedings, 228 (1976).
5. G. Samuelson, Organic Coatings and Plastics Chemistry, 43, 446 (1981).
6. G. Brown, Rel. Physics, 19th Annual Proceedings, Orlando, FL, 282 (1981).
7. E.H. Snow and M. E. Dumesnil, J. Appl. Phys., 37, 2123 (1966).
8. M. Hudis, “Plasma Treatment of Solid Materials, ” John Wiley and Sons, New York (1974).
9. H. Schonhorn, S. W. Ryan, and R. H. Hansen, J. Adhesion, 2, 93 (1970).