Controlling the margins in 300 mm manufacturing

Solid State Technology

Volumn 47, Issue 2, 2004, Pages 49-52

  Bode, Christopher A ^a   Sonderman, Thomas J ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED PROCESS CONTROL (APC); DYNAMIC ADAPTIVE SAMPLING (DAS); ELECTRICAL PARAMETER CONTROL (EPC);

ADAPTIVE CONTROL SYSTEMS; CONTROL SYSTEMS; CONTROL THEORY; DATA PROCESSING; DATA STORAGE EQUIPMENT; DEPOSITION; EMBEDDED SYSTEMS; INVESTMENTS; OPTIMIZATION; PROCESS CONTROL; SILICON WAFERS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 1542573159     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (3)

1. T.J. Sonderman, M.L. Miller, C.A. Bode, "APC as a Competitive Manufacturing Technology: Getting it Right for 300mm," Future Fab International, Issue 12, March 2002.
2. T.J. Sonderman, C.A. Bode, "Advanced Process Control: What's Next on the AMD Roadmap?" in C.J. Progler and B. Singh, editors, Advanced Microelectronic Manufacturing, SPIE, 2003.
3. T.J. Sonderman, C.A. Bode, "Advanced Process Control Technology Evolution Requirements for 300mm Manufacturing," AEC/APC Symposium Asia, 2003.