Curing behavior of wood adhesives under high-pressure steam II. Urea resin

Mokuzai Gakkaishi/Journal of the Japan Wood Research Society

Volumn 42, Issue 1, 1996, Pages 65-73

  Umemura, Kenji ^a   Kawai, Shuichi ^a   Ueno, Rituko ^b   Mizuno, Yasushi ^c   Sasaki, Hikaru ^d  

^a KYOTO UNIVERSITY   (Japan)

^b KINKI UNIVERSITY   (Japan)

^c Oshika Shinko Corp Ltd   (Japan)

^d Akita Prefectural Coll Agr   (Japan)

Author keywords

Curing behavior; Steam injection heating; Urea formaldehyde resin; Wood adhesive

Indexed keywords

EID: 1542539235     PISSN: 00214795     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (19)

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