Precision Alignment Packaging for Microsystems with Multiple Fluid Connections

American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)

Volumn 3, Issue , 2001, Pages 723-730

  Galambos, Paul ^a   Benavides, Gilbert L ^a   Okandan, Murat ^a   Jenkins, Mark W ^a   Hetherington, Dale ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL SAGGING; MICROFLUIDIC DEVICES;

BONDING; CHANNEL FLOW; ELECTRONICS PACKAGING; FLOW INTERACTIONS; LEAKAGE (FLUID); MICROELECTROMECHANICAL DEVICES; PRESSURE EFFECTS; PRINTED CIRCUIT BOARDS; PRODUCT DESIGN; SEALING (CLOSING);

FLUIDIC DEVICES;

EID: 1542432749     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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