Embedded SRAM Bitmapping and Failure Analysis for Manufacturing Yield Improvement

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 129-135

  Glacet, Jean Yves ^a   Lee, Fourmun ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BITMAPS; FOCUSED ION BEAM (FIB);

BINARY CODES; COMPUTER AIDED DESIGN; DEFECTS; EMBEDDED SYSTEMS; FAILURE ANALYSIS; FOCUSING; INSPECTION; ION BEAMS; MICROCONTROLLERS; OPTICAL MICROSCOPY; PROCESS CONTROL; PROM; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE TESTING;

STATIC RANDOM ACCESS STORAGE;

EID: 1542360662     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. E. Hall, D. DiMarco, P. Berndt, and A. Zandi, "A Structured Approach for Failure Analysis of a 256K BiCMOS SRAM", Proceedings ISTFA 1989, pp 167-176.
2. F. T. Agricola and K.F. Anderten, "Failure Mode Analysis Methodology on High Density CMOS SRAMS", Proceedings ISTFA 1989, pp 389-398.