Failure Analysis of Tungsten Stud Defects from the CMP Process

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 315-321

  Takagi, K ^a   Kohno, Y ^a   Nukii, S ^b  

^a ITES Co Ltd   (Japan)

^b IBM JAPAN LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EMISSION MICROSCOPY (EMS); FOCUSED ION BEAMS (FIB); OPTICAL BEAM INDUCED CURRENT (OBIC);

AUGER ELECTRON SPECTROSCOPY; CHEMICAL MECHANICAL POLISHING; CONDENSATION; CURRENT VOLTAGE CHARACTERISTICS; FAILURE ANALYSIS; LIQUID CRYSTALS; LSI CIRCUITS; METALLURGY; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

CRYSTAL DEFECTS;

EID: 1542360608     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)