Mechanical/Plasma Decapsulation Method and Thermal Finite-Element Analysis Provide Explanation for SMB Zener Failures

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1998, Pages 353-357

  Kime, K ^a   Reed, C ^a   DiSilvestro, J ^a   Ruiz, R ^a   Keeton, S ^a   Thome, G P ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PLASMA DECAPSULATION; SURGE TEST PARAMETERS;

ELECTRIC CURRENTS; ELECTRIC POTENTIAL; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; MELTING; MICROPROCESSOR CHIPS; PLASMA APPLICATIONS; RADIOGRAPHY; SOLDERING ALLOYS; SURGE PROTECTION; X RAY ANALYSIS;

ZENER DIODES;

EID: 1542330889     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. C.J. Varker and K.V. Ravi, Electrical Effects of Near Surface Defects in Silicon, SRDL Material Research Laboratory, Technical Report #6.
2. C.L Reed and K.M. Mar, The Effects of Abrasion Gettering on Silicon Material with Swirl Defects, J. ECS Vol.127 No.9 Sep. 1980
3. C.J. Varker, SEM Methods for the Characterization of Semiconductor Materials and Devices, SRDL Material Research Laboratory 1979.