Micro-electromechanical Systems and Test Results of SiC MEMS for High-g Launch Applications

Proceedings of IEEE Sensors

Volumn 1, Issue 2, 2002, Pages 1134-1138

  Katulka, Gary L ^a  

^a U S ARMY RESEARCH LABORATORY   (United States)

Author keywords

Harsh environments; High g; Instrumentation; MEMS; Micro electromechanical systems; Munitions

Indexed keywords

HARSH ENVIRONMENTS; HIGH-G; INSTRUMENTATION;

ENVIRONMENTAL IMPACT; FREQUENCY RESPONSE; GUNS (ARMAMENT); HIGH TEMPERATURE EFFECTS; LAUNCHING; PROJECTILES; SENSORS; SILICON CARBIDE;

MICROELECTROMECHANICAL DEVICES;

EID: 1542271382     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Brown, T.G. and Davis, B., "Dynamic High-g Loading of MEMS sensors: Ground and Flight Testing," Vol. 3512, Proceedings of the SPIE Conf. on Materials and Devices and Characterization in Micromaching, Santa Clara, CA September 1998.
2. Wickenden, D., Davis, B., Dubay, M., "An Extremely Sensitive MEMS Magnetometer for Use as an Orientation Sensor on Projectiles, " Royal Aeronautical Society-Nano Technology and Microengineering for Future Guided Weapons, England, November 1999.
3. Maluf, N., An Introduction to Microelectromechanical Systems Engineering, Artech House, Inc., 2000.