A Novel Method to Analyze the Deep Trench Capacitors in DRAM

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 241-244

  Lee, Jack ^a   Huang, Kuo Hui ^a   Lue, Jen Lang ^a  

^a ProMOS Technologies Inc   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; DEFECTS; DYNAMIC RANDOM ACCESS STORAGE; ENERGY DISPERSIVE SPECTROSCOPY; ETCHING; FAILURE ANALYSIS; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; OPTICAL MICROSCOPY; POLYSILICON; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING FILMS; SILICA; SOLUTIONS; THIN FILM DEVICES; TRANSMISSION ELECTRON MICROSCOPY;

DEEP TRENCH (DT) TECHNOLOGY; ETCHING SOLUTIONS;

SEMICONDUCTOR DEVICE TESTING;

EID: 1542270806     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. P Kucher, H. Aochi, J. Gambino, T. Licata, T. Matsuda, S. Nguyen, M. Okazaki, H. Palm, and M. Ronay, Applied Surface Science, 91, 359-366 (1995)
2. E. Adler, J. K. DeBrosse, S. F. Geissier, S. J. Holmes, M. D. Jaffe, J. B. Johnson, C. W. Koburger III, J. B. Lasky, B. Uoyd, G. L. Miles, J. S. Nakos, W. P. Noble, Jr., S. H. Voldman, M. Armacost, and R. Ferguson, IBM J. Res. Develop. Vol. 39, No. 1/2, January/March , 167-187 (1995)
3. Clarence W. Teng, Yasuhiro Okumoto, Jiann Liu, Ih-Chin Chen, Katsuo Yuhara, and Yoshinobu Yoneoka, VLSITSA, 366-370 (1991)
4. T.T. Sheng and C. C. Chang, IEEE Transactions on Electron Devices, ED-23, 531 (1976)
5. R. B. Marcus and T.T. Sheng, Transmission Electron Microscopy of Silicon VLSI Circuits and Structures, John Wiley and Sons (1983).
6. T.T Sheng, Instruments Today, V15 No. 4, 51 (1994)