Fabrication and Evaluation of A Silicon Probe Array on a Flexible Substrate for Neural Recording

Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings

Volumn 4, Issue , 2003, Pages 3802-3805

  Akamatsu, N ^a   Suzuki, T ^b   Mabuchi, K ^b   Fujita, H ^a   Kim, B J ^a   Takeuchi, S ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

Deep RIE; Flexible probe array; MEMS; Microelectrode; Neural recording; Silicon micromachining

Indexed keywords

ASPECT RATIO; COATINGS; GELATION; MICROELECTRODES; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; REACTIVE ION ETCHING; SILICON; SILICON WAFERS; TISSUE;

DEEP REACTIVE ION ETCHING (RIE); FLEXIBLE PROBE ARRAY; NEURAL RECORDING; SILICON MICROMACHINING;

NEUROLOGY;

EID: 1542270242     PISSN: 05891019     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Campbell,P.K., et al.: A silicon-based, three dimensional- neural interface: Manufacturing process for an intracortical electrode array, IEEE Trans. Biomed. Eng.,20, 413, 1992T.
2. Suzuki, T. Maeda, T. Chinzei, K. Mabuchi, K. Imachi, S. Tachi: Flexible Microelectrode for Interfacing Regenerating Peripheral Nerves, Proceedings of 19th International Conference of the IEEE EMBS (CD-ROM), (1997)
3. Shoji Takeuchi and Isao Shimoyama: Three Dimensional Shape Memory Alloy Microelectrode with Clipping Structure for Insect Neural Recording, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS,VOL.9, NO.1, 24-31, MARCH 2000.
4. Patrick, Griss., et al.: Barbed Spike Arrays for Mechanical Chip Attachment, The 14th IEEE International Conference on MEMS, 46, 2001