Wettability and bonding between Ni and Ti(C, N) with multiple carbide additions

Journal of Materials Science and Technology

Volumn 21, Issue 1, 2005, Pages 53-59

  Liu, Ning ^a   Chen, Minghai ^a   Xu, Yudong ^a   Zhou, Jie ^a   Shi, Min ^a  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Bonding; Diffusion; Interfaces; Ti(C, N) based cermets; Wettability

Indexed keywords

BONDING; DIFFUSION; INTERFACES (MATERIALS); MICROSTRUCTURE; NICKEL; TITANIUM CARBIDE; TITANIUM NITRIDE; VACUUM BRAZING; WETTING;

MULTIPLE CARBIDE ADDITION; NI; SESSIL DROP TECHNIQUE; TI (C,N); WETTABILITY;

CERMETS;

EID: 15044344646     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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