A novel method for making high aspect ratio solid diamond tips

Microelectronic Engineering

Volumn 78-79, Issue 1-4, 2005, Pages 353-358

  Wang, Zongli ^a,b   Gu, Changzhi ^a   Li, Junjie ^a   Cui, Zheng ^c  

^a INSTITUTE OF PHYSICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^c RUTHERFORD APPLETON LABORATORY   (United Kingdom)

Author keywords

FIB milling; HFCVD; Solid diamond tips

Indexed keywords

ASPECT RATIO; CHEMICAL VAPOR DEPOSITION; OPTIMIZATION; POLYMETHYL METHACRYLATES; RAMAN SCATTERING; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING FILMS; SILICON; THERMAL CONDUCTIVITY;

FOCUSED ION BEAM (FIB) MILLING; HOT-FILAMENT CHEMICAL VAPOR DEPOSITION (HFCVD); NANOINDENTATION; SOLID DIAMOND TIPS;

SEMICONDUCTING DIAMONDS;

EID: 14944372152     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.047     Document Type: Conference Paper

References (7)

1. P.K. Baumann, and R.J. Nemanich Diam. Relat. Mater. 7 1998 612
2. A.R. Krauss, O. Auciello, M.Q. Ding, D.M. Gruen, Y. Huang, V.V. Zhirnov, E.I. Givargizov, A. Breskin, S. Pimenov, A. Karabutov, A. Rakhimov, and N. Suetin J. Appl. Phys. 89 5 2001 2958
3. W.J. Zhang, X.M. Meng, C.Y. Chan, Y. Wu, I. Bello, and S.T. Lee Appl. Phys. Lett. 82 16 2003 2622
4. W.P. Kang, J.L. Davidson, A. Wisitsora, D.V. Kerns, and S. Kerns J. Vac. Sci. Technol. B 19 3 2001 936
5. A. Olbrich, B. Ebersberger, C. Boit, P. Niedermann, W. Hänni, J. Vancea, and H. Hoffmann J. Vac. Sci. Technol. B 17 4 1999 1570
6. E. Oesterschulze, W. Scholz, Ch. Mihalcea, D. Albert, B. Sobisch, and W. Kulisch Appl. Phys. Lett. 70 4 1997 435
7. V.C. George, A. Das, M. Roy, A.K. Dua, P. Raj, and D.R.T. Zahn Thin Solid Films 419 2002 114