Etching of sub-micron high aspect ratio holes in oxides and polymers

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 330-335

  Boucher, R ^a   Hubner U ^a   Morgenroth, W ^a   Roth, H ^a   Meyer, H G ^a   Schmidt, M ^b   Eich, M ^b  

^a LEIBNIZ INSTITUTE OF PHOTONIC TECHNOLOGY   (Germany)

^b HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

High aspect ratio etching; High density plasma etching; Pattern transfer; Pentoxide etching; Polymer etching

Indexed keywords

ASPECT RATIO; BUTENES; CRYSTAL STRUCTURE; ELECTRON CYCLOTRON RESONANCE; ETCHING; PHOTONS; POLYMETHYL METHACRYLATES; SILICA; SURFACE ROUGHNESS; TANTALUM COMPOUNDS;

HIGH ASPECT RATIO ETCHING; HIGH DENSITY PLASMA ETCHING; PATTERN TRANSFER; PENTOXIDE ETCHING; POLYMER ETCHING;

MICROELECTRONICS;

EID: 14944372113     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00120-0     Document Type: Conference Paper

References (8)

1. Jonsson L.B., Westlinder J., Engelmark F., Hedlund C., Du J., Smith U., Blom H.O. J. Vac. Sci. Technol. B. 18(4):2000;1906 Kuo Y. J. Electrochem. Soc. 139(2):1992;579.
2. Jonsson L.B., Westlinder J., Engelmark F., Hedlund C., Du J., Smith U., Blom H.O. J. Vac. Sci. Technol. B. 18(4):2000;1906 Kuo Y. J. Electrochem. Soc. 139(2):1992;579.
3. Lee K.P., Jung K.B., Singh R.K., Pearton S.J., Hobbs C., Tobin P. J. Vac. Sci. Technol. A. 18(4):2000;1169.
4. Chen M., Lee Y.H. J. Electrochem. Soc. 131(19):1984;2118.
5. Samukawa S. Jpn. J. Appl. Phys. 33:1994;2133.
6. Liguda C., Böttger G., Kuligk A., Blum R., Eich M., Roth H., Kunert J., Morgenroth W., Elsner H., Meyer H.G. Appl. Phys. Lett. 78(17):2001;2434.
7. Vitale S.A., Chee H., Sawin H.H. J. Vac. Sci. Technol. A. 18(6):2000;2770.
8. Lide D.R. Handbook of Chemistry and Physics. 78th ed. 1997;CRC Press.