A systematic study of dry etch process for profile control of silicon tips

Microelectronic Engineering

Volumn 78-79, Issue 1-4, 2005, Pages 147-151

  Tao, Jiarui ^a,b   Chen, Yifang ^a   Malik, Adnan ^a   Wang, Ling ^a   Zhao, Xingzhong ^b   Li, Hongwei ^c   Cui, Zheng ^a  

^a RUTHERFORD APPLETON LABORATORY   (United Kingdom)

^b WUHAN UNIVERSITY   (China)

^c UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

Dry etch; Electron beam lithography; Nanoimprint lithography; Ultra sharp tips

Indexed keywords

ELECTRON BEAM LITHOGRAPHY; FABRICATION; GASES; NANOTECHNOLOGY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PROFILOMETRY; SILICON; SULFUR COMPOUNDS;

DRY ETCH; FLOW RATE; NANOIMPRINT LITHOGRAPHY; ULTRASHARP TIPS;

ETCHING;

EID: 14944368302     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.020     Document Type: Conference Paper

References (3)

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